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tla-tools/hardware/connectors/TLA Probes.pretty/TLA P686x P6880 Thin.kicad_mod
2024-08-27 12:05:21 -05:00

106 lines
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(footprint "TLA P686x P6880 Thin" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 0)
(descr "TLA pressure-connect probe footprint, Thin PCB Variant")
(attr smd)
(fp_text reference "REF**" (at -12.8016 -4.0894 unlocked) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 7a5c8256-39b9-4b7c-8e94-6ff2f44a2d74)
)
(fp_text value "TLA P686x P6880" (at -12.8524 4.1656 unlocked) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 69b8cdc6-979f-4392-9f7f-d1f77a0d0f88)
)
(fp_rect (start 3.2512 -3.175) (end -28.8798 3.175) (layer "B.SilkS") (width 0.12) (fill none) (tstamp 65e380f8-5c0b-43d1-b1f9-ad64ba9b6d7a))
(fp_line (start -3.683 -4.318) (end -3.683 4.572) (layer "F.SilkS") (width 0.12) (tstamp 8d5dcfec-1319-462a-822a-0742459ea108))
(fp_rect (start 3.2512 -3.175) (end -28.8798 3.175) (layer "F.SilkS") (width 0.12) (fill none) (tstamp 1192601f-6dfc-4669-adc5-e0b83bc13a36))
(fp_rect (start 3.2512 -3.175) (end -28.8798 3.175) (layer "B.CrtYd") (width 0.12) (fill none) (tstamp c6609c0c-99cd-4ce4-a799-4baf9dd7415e))
(fp_rect (start 3.2512 -3.175) (end -28.8798 3.175) (layer "F.CrtYd") (width 0.12) (fill none) (tstamp a554d650-4d01-4a8d-8ea4-29f47d8460d9))
(pad "" np_thru_hole circle (at 0 0) (size 3.5052 3.5052) (drill 3.5052) (layers F&B.Cu *.Mask) (tstamp 57363f42-761a-43eb-afe1-8a0dbe13486f))
(pad "" np_thru_hole circle (at -3.683 -1.143) (size 1.7018 1.7018) (drill 1.7018) (layers F&B.Cu *.Mask) (tstamp 88c14b4c-dfb2-4aa3-b94e-6542bca525b5))
(pad "" np_thru_hole circle (at -25.654 0) (size 3.5052 3.5052) (drill 3.5052) (layers F&B.Cu *.Mask) (tstamp ec8ab956-4019-45bd-939e-fb915d9d88fc))
(pad "A1" smd rect (at -5.1816 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 0d7fce48-8ebb-4f8d-9a48-0f975d8eaf0d))
(pad "A2" smd rect (at -6.096 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 37550e6d-4875-47a5-b8cf-0a0a83c78325))
(pad "A3" smd rect (at -7.0104 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp a350599d-bf5e-4199-9c45-5f25024f1a3b))
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(pad "A5" smd rect (at -9.7536 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 6c2868fa-354e-428c-ae4a-92fd00488438))
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(pad "A8" smd rect (at -13.4112 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp a1d6e429-3364-4f30-9dd6-0145b5e8c56e))
(pad "A9" smd rect (at -14.3256 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp bd4e2c95-5dfe-4a03-b5ff-de89ba14de6f))
(pad "A10" smd rect (at -16.1544 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp cee20453-c7c4-4c0f-b6fa-f4298ff02c6f))
(pad "A11" smd rect (at -17.0688 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 186dd84e-a516-4162-b228-abc76510c8b9))
(pad "A12" smd rect (at -17.9832 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp b40c6c60-a497-4b7e-af70-489c9903755d))
(pad "A13" smd rect (at -19.812 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp c1bcc36f-1a6e-4bbf-88bb-71e21687d332))
(pad "A14" smd rect (at -20.7264 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 4281bf73-98ef-416f-9757-80e8dde0cf5f))
(pad "A15" smd rect (at -21.6408 1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 61348d70-6c83-4ef2-b575-30e3c12a6b29))
(pad "B1" smd rect (at -7.5184 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 2da7efde-4a44-4816-ab43-0540b541de67))
(pad "B2" smd rect (at -8.4328 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 4d24c56a-6c90-459d-a14a-ae52700001bd))
(pad "B3" smd rect (at -9.3472 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 6fa7ebeb-b2ae-4848-ba37-64daa7916a87))
(pad "B4" smd rect (at -11.176 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 40586710-9024-47e2-b47b-2554f049991a))
(pad "B5" smd rect (at -12.0904 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp e2ca2d97-d3de-4590-88a6-0af023b965cb))
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(pad "B7" smd rect (at -14.8336 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 593e47e3-56be-4d51-bced-79f9adb25f61))
(pad "B8" smd rect (at -15.748 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp f310826c-9638-4230-abff-1683414b4245))
(pad "B9" smd rect (at -16.6624 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp ebfaafae-7167-4030-898d-538c917de8f2))
(pad "B10" smd rect (at -18.4912 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp db4add4d-f489-4702-ae2c-2d8819bf416c))
(pad "B11" smd rect (at -19.4056 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp b4309df5-3b16-41df-ab77-a51afd1230c6))
(pad "B12" smd rect (at -20.32 -1.5748) (size 0.4064 0.8128) (layers "F.Cu" "F.Mask") (tstamp 024cccb8-2623-4849-a881-6e017dc7ed09))
(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 16ec458b-b31b-482c-add8-f6df7d8276d8) (hatch edge 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias not_allowed) (pads allowed) (copperpour allowed) (footprints allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
(polygon
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 86e1a750-fe74-4ca0-b200-0a6c7913c504) (name "Frontside Component Keepout") (hatch none 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed) (copperpour allowed) (footprints not_allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(zone (net 0) (net_name "") (layer "F.Cu") (tstamp 8ed5cb5d-01ba-4681-83d1-2a7116a34828) (hatch edge 0.508)
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(keepout (tracks allowed) (vias not_allowed) (pads allowed) (copperpour allowed) (footprints allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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(zone (net 0) (net_name "") (layer "B.Cu") (tstamp 4290d01b-5830-458c-9c60-e8aab1044c46) (name "Backside Component Keepout") (hatch none 0.508)
(connect_pads (clearance 0))
(min_thickness 0.254)
(keepout (tracks allowed) (vias allowed) (pads allowed) (copperpour allowed) (footprints not_allowed))
(fill (thermal_gap 0.508) (thermal_bridge_width 0.508))
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